Micron announces volume production of PCM/DRAM multichip packaged memory

Totally not expecting this. Today Micron announced high-volume availability of a multichip, packaged memory device that incorporates a 1Gbit PCM (Phase-Change Memory) and a 512Mbit LPDDR2 SDRAM. The PCM die is built with 45nm process technology. The multichip-packaged memory is aimed at mobile devices because of the low-power, high-performance, and small footprint of the combined PCM/SDRAM device. Full announcement here.

Advertisements

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at http://eda360insider.wordpress.com/)
This entry was posted in DRAM, LPDDR2, Micron, PCM, SDRAM and tagged , , , . Bookmark the permalink.

One Response to Micron announces volume production of PCM/DRAM multichip packaged memory

  1. Pingback: Want more details about the new Micron 1Gbit Phase-Change Memory / 512Mbit SDRAM device? Here are several | Denali Memory Report

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s