Totally not expecting this. Today Micron announced high-volume availability of a multichip, packaged memory device that incorporates a 1Gbit PCM (Phase-Change Memory) and a 512Mbit LPDDR2 SDRAM. The PCM die is built with 45nm process technology. The multichip-packaged memory is aimed at mobile devices because of the low-power, high-performance, and small footprint of the combined PCM/SDRAM device. Full announcement here.
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The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
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