Category Archives: HMC

What does Intel’s choice of GDDR5 graphics DRAM for main memory with its Manycore Xeon Phi coprocessor say about SoC design?

Posted on August 28, 2012 by sleibson2

George Chrysos discussed the Intel MIC (Many Integrated Core) architecture of the Knights Bridge chip (officially called the Intel Xeon Phi coprocessor) at today’s Hot Chips 24 conference and disclosed that it uses GDDR5 graphics memory as the main memory … Continue reading →

Posted in DDR, HMC, Hybrid Memory Cube, SDRAM | Tagged , , , , , | 1 Comment

Memcon is filling up. Register now to be sure you get a ticket. It’s free. September 18. Silicon Valley

Posted on August 25, 2012 by sleibson2

The Flash Memory Summit took place this week and registration for next month’s Memcon in Silicon Valley suddenly took a big uptick. I’d like to suggest that if you want to be certain to attend Memcon next month, you might … Continue reading →

Posted in DRAM, Flash, HMC, Hybrid Memory Cube | Tagged , , | Leave a comment

Friday Video: A personal invitation to Memcon from Sanjay Srivastava

Posted on August 17, 2012 by sleibson2

Want to know why you need to be at Memcon this year? Here’s Denali Software founder Sanjay Srivastava to tell you why: Now go and sign up! It’s a free ticket and includes breakfast, lunch, and some goodies—not to mention … Continue reading →

Posted in DDR3, DDR4, DRAM, Flash, HMC, Hybrid Memory Cube, JEDEC, LPDDR2, LPDDR3, LPDDR4, Memcon, MRAM, mSATA, NAND, NOR, NVM Express, NVMe, ONFI, PCIe, Samsung, SAS, SATA, SD, SDRAM | Tagged , , , | Leave a comment

Initial Hybrid Memory Cube short-reach interconnect specification issued to Consortium adopters

Posted on August 14, 2012 by sleibson2

The Hybrid Memory Cube Consortium (HMCC), now supported by the three top DRAM vendors (Samsung, SK hynix, and Micron), has just issued an initial draft specification for the Hybrid Memory Cube’s “short-reach interconnection across physical layers”—in other words, the short-reach … Continue reading →

Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix, Micron, Samsung | Tagged , , , , , , | Leave a comment

Want another opinion about the Hybrid Memory Cube? Michael Feldman of HPCwire.com weighs in

Posted on July 11, 2012 by sleibson2

Michael Feldman over at HPCwire.com has just published his own analysis of the Hybrid Memory Cube (HMC), which I’ve covered extensively in the EDA360 Insider and the Denali Memory Report (see below). Feldman reiterates many of the same points I’ve … Continue reading →

Posted in DDR, DRAM, HMC, Hybrid Memory Cube, Micron | Tagged , , , , , | Leave a comment

ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC). First spec due by end of year

Posted on June 28, 2012 by sleibson2

Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading →

Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix | Tagged , , , , , , | 1 Comment

It’s Official: Microsoft joins 3D Hybrid Memory Cube Consortium with Micron, Samsung, Altera, IBM, Open-Silicon, and Xilinx

Posted on May 14, 2012 by sleibson2

Last week, the Hybrid Memory Cube Consortium announced that Microsoft had joined Micron, Samsung, Altera, IBM, Open-Silicon, and Xilinx in the development of high-performance 3D SDRAM subsystems based on the Hybrid Memory Cube. For more information on the Hybrid Memory … Continue reading →

Posted in 3D, DRAM, HMC, Hybrid Memory Cube | Tagged , , , , , , , | Leave a comment

Want some additional details about the Micron Hybrid Memory Cube?

Posted on March 29, 2012 by sleibson2

This week at Design West (the conference previously known as the Embedded Systems Conference), I had a chance to speak with Mike Black from Micron about the Hybrid Memory Cube (HMC), a 3D DRAM assembly aimed at high-performance computing. The … Continue reading →

Posted in 3D, DRAM, HMC, Hybrid Memory Cube | Tagged , , , , | Leave a comment