Category Archives: 3D

Want to know why SK hynix is placing its bets on three different alternatives to DRAM and Flash?

Posted on August 27, 2012 by

Last week at the Flash Memory Summit, Dr. Sung Wook Park spoke about memory. No surprise there, but there were several surprises in Park’s presentation. The first surprise popped up in the slide immediately following the keynote presentation’s title slide: … Continue reading →

Posted in 3D, DRAM, Flash, HDD, Hynix, Memristor, MRAM, NAND, PCM, ReRAM, SRAM, SSD | Tagged , , , , , , , | 3 Comments

Initial Hybrid Memory Cube short-reach interconnect specification issued to Consortium adopters

Posted on August 14, 2012 by

The Hybrid Memory Cube Consortium (HMCC), now supported by the three top DRAM vendors (Samsung, SK hynix, and Micron), has just issued an initial draft specification for the Hybrid Memory Cube’s “short-reach interconnection across physical layers”—in other words, the short-reach … Continue reading →

Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix, Micron, Samsung | Tagged , , , , , , | Leave a comment

Jim Handy, The Memory Guy, answers your questions about Flash memory

Posted on July 10, 2012 by

Two weeks ago, Jim Handy (who bills himself and appears on the Internet as “The Memory Guy”) posted a blog discussion about the end of Flash memory scaling. He also posted a notice of the blog as a discussion on … Continue reading →

Posted in 3D, Flash, Memcon, ONFI | Tagged , , , , , , , | Leave a comment

MOSAID and NOVACHIPS announce plans for an HLNAND-based SSD controller chip. Release set for 2013.

Posted on July 9, 2012 by

A couple of weeks ago, MOSAID and NOVACHIPS announced plans to jointly develop an SSD controller based on the MOSAID high-speed HLNAND interface specification. If you’re not familiar with the MOSAID HLNAND high-speed serial interface, join the club. Most NAND … Continue reading →

Posted in 3D, Flash, Hybrid Memory Cube, NAND | Tagged , , , , , , , , | 1 Comment

Applied Materials develops Centura Avatar etcher for enabling 3D NAND Flash manufacture

Posted on July 1, 2012 by

About a year ago, I wrote an EDA360 Insider blog entry about 3D NAND Flash semiconductor memory. (See “3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron”) In this post, I discussed a talk by Glen … Continue reading →

Posted in 3D, Flash, Micron | Tagged , , , , | Leave a comment

Jim Handy, The Memory Guy, writes that Flash memory is dead…but perhaps not just yet

Posted on June 28, 2012 by

My good friend Jim Handy—who writes several blogs including The Memory Guy and The SSD Guy—recently published a blog titled “The End of Flash Scaling.” He writes: “Everyone knows that flash memory is about to hit its scaling limit – … Continue reading →

Posted in 3D, Flash, Memristor, MRAM, ReRAM, SSD | Tagged , , , , , | 1 Comment

ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC). First spec due by end of year

Posted on June 28, 2012 by

Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading →

Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix | Tagged , , , , , , | 1 Comment