Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
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Recent Posts
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
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Meta
Category Archives: 3D
Want to know why SK hynix is placing its bets on three different alternatives to DRAM and Flash?
Last week at the Flash Memory Summit, Dr. Sung Wook Park spoke about memory. No surprise there, but there were several surprises in Park’s presentation. The first surprise popped up in the slide immediately following the keynote presentation’s title slide: … Continue reading
Initial Hybrid Memory Cube short-reach interconnect specification issued to Consortium adopters
The Hybrid Memory Cube Consortium (HMCC), now supported by the three top DRAM vendors (Samsung, SK hynix, and Micron), has just issued an initial draft specification for the Hybrid Memory Cube’s “short-reach interconnection across physical layers”—in other words, the short-reach … Continue reading
Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix, Micron, Samsung
Tagged Hybrid Memory Cube, IBM, Micron, MicronTechnology, PHY, Samsung, SerDes
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Jim Handy, The Memory Guy, answers your questions about Flash memory
Two weeks ago, Jim Handy (who bills himself and appears on the Internet as “The Memory Guy”) posted a blog discussion about the end of Flash memory scaling. He also posted a notice of the blog as a discussion on … Continue reading
Posted in 3D, Flash, Memcon, ONFI
Tagged Charge Trap Flash, Flash, Flash memory, Jim Handy, LinkedIn, Memory Guy, Open NAND Flash Interface Working Group, Solid-state drive
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MOSAID and NOVACHIPS announce plans for an HLNAND-based SSD controller chip. Release set for 2013.
A couple of weeks ago, MOSAID and NOVACHIPS announced plans to jointly develop an SSD controller based on the MOSAID high-speed HLNAND interface specification. If you’re not familiar with the MOSAID HLNAND high-speed serial interface, join the club. Most NAND … Continue reading
Posted in 3D, Flash, Hybrid Memory Cube, NAND
Tagged Flash memory, Flash memory controller, HyperLink, MOSAID, NAND Flash, NOVACHIPS, PCI Express, Solid-state drive, SSD
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Applied Materials develops Centura Avatar etcher for enabling 3D NAND Flash manufacture
About a year ago, I wrote an EDA360 Insider blog entry about 3D NAND Flash semiconductor memory. (See “3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron”) In this post, I discussed a talk by Glen … Continue reading
Jim Handy, The Memory Guy, writes that Flash memory is dead…but perhaps not just yet
My good friend Jim Handy—who writes several blogs including The Memory Guy and The SSD Guy—recently published a blog titled “The End of Flash Scaling.” He writes: “Everyone knows that flash memory is about to hit its scaling limit – … Continue reading
Posted in 3D, Flash, Memristor, MRAM, ReRAM, SSD
Tagged Flash, Flash memory, Flash memory controller, Hynix, NAND Flash, SSD
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ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC). First spec due by end of year
Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading