Category Archives: MCP

Quickly Noted: EETimes on the challenges of testing semiconductor memory for mobile applications. Is testing really a 3D IC “stopper”?

Janine Love at EETimes interviewed Cecil Ho, President of CST (—a memory tester vendor, about issues surrounding the testing of semiconductor memory that’s optimized for and aimed at mobile applications. In these applications board real estate and physical volume are … Continue reading

Posted in 3D, DRAM, Flash, MCP | Tagged , , , | 1 Comment