Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
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Recent Posts
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
Archives
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Meta
Tag Archives: Wide I/O
Invensas to detail POP interconnect to rival Wide I/O with as many as 1200 interconnections between IC packages
Later this week, Invensas will detail its new BVA (bond via array) package-on-package (POP) interconnect that can achieve 1200 electrical connections between chip packages without the use of 3D die assembly. Information on the technology will be contained in a … Continue reading
Posted in 3D, Wide I/O
Tagged 3D, Package on package, Surface-mount technology, Wide I/O
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A possible roadmap for Wide I/O that leads to 2Tbps of SDRAM memory bandwidth—per device
Cadence Product Marketing Director Marc Greenberg—one of the speakers at last week’s EDPS conference held in Monterey, California—spoke about why the Wide I/O SDRAM is probably the “killer app” that unleashes 3D IC assembly into the mainstream. Richard Goering has … Continue reading
Posted in DDR, DDR3, DDR4, DRAM, SDRAM, Wide I/O
Tagged DDR SDRAM, Double data rate, JEDEC, Memory bandwidth, Wide I/O
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Is Wide I/O SDRAM a disruptive technology? Signs say yes according to new EETimes article
A new article about Wide I/O and 3D IC assembly published in EETimes brings some additional technical information to light. The article was written by Marc Greenberg and Samta Bansal, both from Cadence, and it contains both a review of … Continue reading
Big week for Wide I/O: JEDEC publishes spec while Elpida ships sample 4Gbit parts
Wide I/O jumped closer to being a reality this week with two major announcements. On December 28th, Elpida announced that they were making sample shipments of 4Gbit Wide-IO. (See “Let’s start the new year with a bang! Elpida ships 4Gbit … Continue reading
Posted in JEDEC, LPDDR2, SDRAM, Wide I/O
Tagged Elpida, Elpida Memory, JEDEC, LPDDR2, SDRAM, ST-Ericsson, Wide I/O
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Let’s start the new year with a bang! Elpida ships 4Gbit Wide I/O and LPDDR3 SDRAM samples
Two DRAM categories that will shake up mobile product design this year are Wide I/O and LPDDR3. Elpida announced just at the end of the year that it has started shipping samples of 4Gbit SDRAMs with both interface types based … Continue reading
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