Monthly Archives: April 2012

Do you know the advantages and disadvantages of the six different use cases for SSDs?

Marc Staimer, founder and senior analyst at Dragon Slayer Consulting, has just published an excellent primer on locating SSD storage within a server and storage network. With the advent of PCIe-based SSD storage based on NAND Flash memory, the number … Continue reading

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Qualcomm’s Nick Yu says “3D DRAM stacking has started—it’s shipping in products… we need low-cost 3D IC assembly”

Today’s GSA Silicon Summit held at the Computer History Museum in Mountain View, California included a talk on 3D IC assembly by Nick Yu, VP of Engineering, VLSI Engineering, at Qualcomm. Yu is in charge of Qualcomm’s technology roadmaps including … Continue reading

Posted in 3D, DRAM, SDRAM, Wide I/O | Tagged , , , , | 1 Comment

Designing circuit boards with DDR3? Full-day, hands-on tutorial in Europe shows you how. Munich, May 14

System designs employing DDR3 SDRAMs present many new pcb design challenges compared to DDR2. DDR3 clock, address, and control lines employ a new fly-by topology; setup and hold times need to be just right because there are reduced timing margins … Continue reading

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Spansion CEO maps divergent semiconductor memory strategy at Globalpress—a destiny that leads to smart memory

Spansion CEO John Kispert mapped out an individualized product strategy for the semiconductor memory vendor at today’s Globalpress Electronics Summit being held this week in Santa Cruz, California. Kispert first pointed out that Spansion currently has approximately 8000 customers who … Continue reading

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Lexar translates USB 3.0 specs into significant benefits that consumers care about with the new S73 JumpDrive

Sometimes, we insiders get pretty esoteric in the way we describe technological improvements. Take SuperSpeed USB 3.0 for example. Most consumers know it’s faster than USB 2.0—after all, 3.0 is bigger than 2.0 so it must be better—but perhaps they … Continue reading

Posted in Flash, NAND, ONFI, USB | Leave a comment

BIWIN America introduces 12x20mm e-MMC SSDs with on-chip controller, power-on boot, explicit sleep mode

BIWIN America has just announced a “single-chip” SSD device employing the e-MMC interface. The device is available in capacities from 2 to 64Gbytes, all packed into a 169-ball BGA package measuring 12x20x1mm. An integral SSD controller provides built-in BCH error … Continue reading

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Low-cost Intel 330 series SSDs sport SandForce SF-2281 SSD Controller

According to this extremely informative article on the Anandtech.com site, Intel’s just-released 330 series SSDs push Intel into the low-cost SSD zone using the SandForce SF-2281 SSD controller. Apparently, Intel’s 520 SSD series also employs this controller, but the use … Continue reading

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