Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
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Recent Posts
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
Archives
What's hot on the Denali Memory Report?
Categories
- 3D
- ARM
- Compact Flash
- Cortex-A15
- DDR
- DDR3
- DDR4
- DFI
- DRAM
- eMMC
- Ethernet
- Exynos
- Flash
- HDD
- HMC
- Hybrid Memory Cube
- Hynix
- JEDEC
- LeCroy
- LPDDR
- LPDDR2
- LPDDR3
- LPDDR3E
- LPDDR4
- LRDIMM
- Marvell
- MCP
- Memcon
- Memristor
- Micron
- MLC
- MRAM
- mSATA
- NAND
- NOR
- NVM Express
- NVMe
- ONFI
- PCIe
- PCM
- QDR
- ReRAM
- Samsung
- SAS
- SATA
- SD
- SDRAM
- SLC
- SRAM
- SSD
- Storage
- Toggle
- UFS
- Uncategorized
- USB
- Wide I/O
- XQD
Meta
Tag Archives: Surface-mount technology
Invensas to detail POP interconnect to rival Wide I/O with as many as 1200 interconnections between IC packages
Later this week, Invensas will detail its new BVA (bond via array) package-on-package (POP) interconnect that can achieve 1200 electrical connections between chip packages without the use of 3D die assembly. Information on the technology will be contained in a … Continue reading
Posted in 3D, Wide I/O
Tagged 3D, Package on package, Surface-mount technology, Wide I/O
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