Tag Archives: Open-Silicon

ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC). First spec due by end of year

Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading

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It’s Official: Microsoft joins 3D Hybrid Memory Cube Consortium with Micron, Samsung, Altera, IBM, Open-Silicon, and Xilinx

Last week, the Hybrid Memory Cube Consortium announced that Microsoft had joined Micron, Samsung, Altera, IBM, Open-Silicon, and Xilinx in the development of high-performance 3D SDRAM subsystems based on the Hybrid Memory Cube. For more information on the Hybrid Memory … Continue reading

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