Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
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- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
What's hot on the Denali Memory Report?
- Compact Flash
- Hybrid Memory Cube
- NVM Express
- Wide I/O
Tag Archives: MicronTechnology
Initial Hybrid Memory Cube short-reach interconnect specification issued to Consortium adopters
The Hybrid Memory Cube Consortium (HMCC), now supported by the three top DRAM vendors (Samsung, SK hynix, and Micron), has just issued an initial draft specification for the Hybrid Memory Cube’s “short-reach interconnection across physical layers”—in other words, the short-reach … Continue reading
Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix, Micron, Samsung Tagged Hybrid Memory Cube, IBM, Micron, MicronTechnology, PHY, Samsung, SerDes Leave a comment
Want more details about the new Micron 1Gbit Phase-Change Memory / 512Mbit SDRAM device? Here are several
Yesterday, Micron announced volume production of a new memory device containing one 1Gbit PCM (phase-change memory) die and one 512Mbit LPDDR2 SDRAM die. This morning, I had a conversation about this new device with Philippe Berge—Senior Director of the NOR, … Continue reading
Posted in DDR, Flash, LPDDR2, Micron, NOR, PCM, Storage Tagged Flash memory, Micron, MicronTechnology, Mobile DDR, NOR Flash, PCM, Phase-change memory, Synchronous dynamic random-access memory Leave a comment