Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
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Recent Posts
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
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Tag Archives: IBM
IBM gets patent for hi-temp PCM (phase-change memory) cell structure
Tom’s Hardware is reporting that IBM recently obtained a patent on specially formulated phase-change memory (PCM) that will operate above 150°C. This is a significant achievement because PCM has a problem with ambient thermal annealing. If the chip temperature goes … Continue reading
Want to know why SK hynix is placing its bets on three different alternatives to DRAM and Flash?
Last week at the Flash Memory Summit, Dr. Sung Wook Park spoke about memory. No surprise there, but there were several surprises in Park’s presentation. The first surprise popped up in the slide immediately following the keynote presentation’s title slide: … Continue reading
Initial Hybrid Memory Cube short-reach interconnect specification issued to Consortium adopters
The Hybrid Memory Cube Consortium (HMCC), now supported by the three top DRAM vendors (Samsung, SK hynix, and Micron), has just issued an initial draft specification for the Hybrid Memory Cube’s “short-reach interconnection across physical layers”—in other words, the short-reach … Continue reading
Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix, Micron, Samsung
Tagged Hybrid Memory Cube, IBM, Micron, MicronTechnology, PHY, Samsung, SerDes
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How many DRAMs does it take to populate a supercomputer? 746,496 plus a lot of hot water for cooling
Jim Handy, The Memory Guy, posted a short blog about the 3-petaFLOP (peak) SuperMUC supercomputer at the Leibniz Supercomputing Centre on the outskirts of Munich, Germany. (The “MUC” in SuperMUC is the 3-letter code for the Munich airport. Now that’s … Continue reading
ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC). First spec due by end of year
Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading
Whoa, Momma! Flash memory maker SK Hynix enters the SSD market. Take a look at these performance charts!
Jim Handy, the “SSD Guy” and the “Memory Guy,” just published a short blog post alerting us to the fact that Flash memory maker SK Hynix has entered the SSD market just four days after announcing the purchase of Link_A_Media, … Continue reading
Posted in Flash, mSATA, ONFI, SATA, SSD, Storage
Tagged Flash, Flash memory, Hynix, IBM, Phase-change memory, SK Hynix
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SK Hynix places bet on third wannabe non-volatile memory technology, phase-change memory, with IBM
When I was really young, I used to play a card game called “Pit” where you tried to corner the market on a particular commodity like oranges, sugar, soybeans, or corn. The game was based on the trading pits of … Continue reading
Posted in Hynix, Memristor, MRAM, NAND, PCM
Tagged Flash memory, Hynix, IBM, memristor, Micron, MRAM, Non-volatile memory, Phase-change memory, Samsung, SK Hynix, Toshiba
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It’s Official: Microsoft joins 3D Hybrid Memory Cube Consortium with Micron, Samsung, Altera, IBM, Open-Silicon, and Xilinx
Last week, the Hybrid Memory Cube Consortium announced that Microsoft had joined Micron, Samsung, Altera, IBM, Open-Silicon, and Xilinx in the development of high-performance 3D SDRAM subsystems based on the Hybrid Memory Cube. For more information on the Hybrid Memory … Continue reading
Posted in 3D, DRAM, HMC, Hybrid Memory Cube
Tagged Altera, Hybrid Memory Cube, IBM, Micron, Microsoft, Open-Silicon, Samsung, Xilinx
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Want some additional details about the Micron Hybrid Memory Cube?
This week at Design West (the conference previously known as the Embedded Systems Conference), I had a chance to speak with Mike Black from Micron about the Hybrid Memory Cube (HMC), a 3D DRAM assembly aimed at high-performance computing. The … Continue reading
Posted in 3D, DRAM, HMC, Hybrid Memory Cube
Tagged Altera, FPGA, HMC, Hybrid Memory Cube, IBM
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IBM’s Almaden Labs sets lower mass bound for nanoscale magnetic storage: 12 atoms
Researchers at the IBM Almaden Labs south of San Jose, CA have experimentally set the lower bound on magnetic storage at 12 atoms. It appears that eight atoms can’t quite cut it. Although the atoms are iron atoms, their antiferromagnetic … Continue reading
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