Tag Archives: HMC

Want another opinion about the Hybrid Memory Cube? Michael Feldman of HPCwire.com weighs in

Posted on July 11, 2012 by sleibson2

Michael Feldman over at HPCwire.com has just published his own analysis of the Hybrid Memory Cube (HMC), which I’ve covered extensively in the EDA360 Insider and the Denali Memory Report (see below). Feldman reiterates many of the same points I’ve … Continue reading →

Posted in DDR, DRAM, HMC, Hybrid Memory Cube, Micron | Tagged , , , , , | Leave a comment

ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC). First spec due by end of year

Posted on June 28, 2012 by sleibson2

Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading →

Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix | Tagged , , , , , , | 1 Comment

Want some additional details about the Micron Hybrid Memory Cube?

Posted on March 29, 2012 by sleibson2

This week at Design West (the conference previously known as the Embedded Systems Conference), I had a chance to speak with Mike Black from Micron about the Hybrid Memory Cube (HMC), a 3D DRAM assembly aimed at high-performance computing. The … Continue reading →

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Microprocessor Report names Micron Hybrid Memory Cube as “Best Microprocessor Technology” of the year

Posted on January 24, 2012 by sleibson2

This week, Microprocessor Report selected the Micron Hybrid Memory Cube (HMC) as the “Best Microprocessor Technology” of 2011. Why? As Tom Halfhill writes: “Memory cubes promise greater density, lower latency, higher bandwidth, and better power efficiency per bit compared with … Continue reading →

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