Tag Archives: GSM

Qualcomm’s Nick Yu says “3D DRAM stacking has started—it’s shipping in products… we need low-cost 3D IC assembly”

Today’s GSA Silicon Summit held at the Computer History Museum in Mountain View, California included a talk on 3D IC assembly by Nick Yu, VP of Engineering, VLSI Engineering, at Qualcomm. Yu is in charge of Qualcomm’s technology roadmaps including … Continue reading

Posted in 3D, DRAM, SDRAM, Wide I/O | Tagged , , , , | 1 Comment