Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
Subscribe to Denali Memory Report!
-
Recent Posts
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
Archives
What's hot on the Denali Memory Report?
Categories
- 3D
- ARM
- Compact Flash
- Cortex-A15
- DDR
- DDR3
- DDR4
- DFI
- DRAM
- eMMC
- Ethernet
- Exynos
- Flash
- HDD
- HMC
- Hybrid Memory Cube
- Hynix
- JEDEC
- LeCroy
- LPDDR
- LPDDR2
- LPDDR3
- LPDDR3E
- LPDDR4
- LRDIMM
- Marvell
- MCP
- Memcon
- Memristor
- Micron
- MLC
- MRAM
- mSATA
- NAND
- NOR
- NVM Express
- NVMe
- ONFI
- PCIe
- PCM
- QDR
- ReRAM
- Samsung
- SAS
- SATA
- SD
- SDRAM
- SLC
- SRAM
- SSD
- Storage
- Toggle
- UFS
- Uncategorized
- USB
- Wide I/O
- XQD
Meta
Tag Archives: DDR4
Samsung starts to sample 16Gbyte DDR4 LRDIMMs using 30nm-class DDR4 memory chips
Today, Samsung announced that it has started to sample 16Gbyte DDR4 SDRAM RDIMMs (registered DIMMs) based on its 30nm-class DDR4 SDRAM chips. Last month, the company announced sampling of 8 and 16Gbyte DDR4 modules and a 2Gbyte DDR4 module was … Continue reading
Free Webinar on essential memory and storage verification IP: DDR3/4, LRDIMM, 12Gbps SAS, NVMe, Ethernet. April 10.
Verification IP (VIP) is an essential component of the development process for all ICs and systems and now you have the chance to listen to a free April 10 Webinar on applying that essential component in memory and storage applications. … Continue reading
Agilent: Memory technology has hit a wall due to physics limitations and that has implications for your designs
Last week, Agilent ran a seminar in Milpitas, California. The first of three subseminars was about memory technology with an excellent overview of the state of memory technology today. It was presented by Gordon Getty, an Agilent Application Engineer based … Continue reading
More DDR4, DDR3, and 3D IC technical details from ISSCC, courtesy of memory analyst and expert Jim Handy
Semiconductor memory analyst and expert Jim Handy has just published an overview of some memory papers given at last week’s ISSCC. Handy’s article on the ElectroIQ web site supplements some of the previous Denali Memory Report blog entries published earlier … Continue reading
Operational DDR4 SDRAM prototypes appear at ISSCC
As reported this week by several Web sites including Techeye.net, Samsung and Hynix both demonstrated working prototypes of DDR4 SDRAM at the ISSCC conference in San Francisco this week. The Samsung and Hynix DDR4 memories were manufactured in 30nm and … Continue reading
Posted in DDR4, SDRAM
Tagged DDR4, Elpida, Elpida Memory, Hynix, International Solid-State Circuits Conference, ISSCC, Micron Technology, Samsung, SDRAM, Server memory
1 Comment