Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
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Recent Posts
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
Archives
What's hot on the Denali Memory Report?
Categories
- 3D
- ARM
- Compact Flash
- Cortex-A15
- DDR
- DDR3
- DDR4
- DFI
- DRAM
- eMMC
- Ethernet
- Exynos
- Flash
- HDD
- HMC
- Hybrid Memory Cube
- Hynix
- JEDEC
- LeCroy
- LPDDR
- LPDDR2
- LPDDR3
- LPDDR3E
- LPDDR4
- LRDIMM
- Marvell
- MCP
- Memcon
- Memristor
- Micron
- MLC
- MRAM
- mSATA
- NAND
- NOR
- NVM Express
- NVMe
- ONFI
- PCIe
- PCM
- QDR
- ReRAM
- Samsung
- SAS
- SATA
- SD
- SDRAM
- SLC
- SRAM
- SSD
- Storage
- Toggle
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- Uncategorized
- USB
- Wide I/O
- XQD
Meta
Tag Archives: DDR SDRAM
DFI 3.1 spec adds DDR4 and LPDDR3 coverage for speed and low-power benefits
Earlier this month, JEDEC published the LPDDR3 specification for the next generation of low-power SDRAM that will be used in mobile devices such as smartphones, tablets, ultra-thin notebooks and similar connected devices on the newest, high-speed 4G networks. The LPDDR3 … Continue reading
Will your multicore SoC hit the memory wall? Will the memory wall hit your SoC? Does it matter?
Multicore SoC and processor designs were our solution to the death of Dennard Scaling when IC process geometries dropped below 90nm, when processor speeds hit 3GHz, and when processor power consumption went off the charts. Since 2004, we’ve transformed Moore’s … Continue reading
Posted in 3D, DDR, DDR3, DDR4, DRAM, Flash, PCIe, Wide I/O
Tagged DDR SDRAM, Graphics processing unit, System-on-a-chip, X86
9 Comments
A possible roadmap for Wide I/O that leads to 2Tbps of SDRAM memory bandwidth—per device
Cadence Product Marketing Director Marc Greenberg—one of the speakers at last week’s EDPS conference held in Monterey, California—spoke about why the Wide I/O SDRAM is probably the “killer app” that unleashes 3D IC assembly into the mainstream. Richard Goering has … Continue reading
Posted in DDR, DDR3, DDR4, DRAM, SDRAM, Wide I/O
Tagged DDR SDRAM, Double data rate, JEDEC, Memory bandwidth, Wide I/O
2 Comments