Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
What's hot on the Denali Memory Report?
- Compact Flash
- Hybrid Memory Cube
- NVM Express
- Wide I/O
Tag Archives: 3D
About a year ago, I wrote an EDA360 Insider blog entry about 3D NAND Flash semiconductor memory. (See “3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron”) In this post, I discussed a talk by Glen … Continue reading
3D can’t move forward until the testability issues are solved. Hear that one? Well, Advantest has just advanced another click in that ratchet with this week’s introduction of a concept model test cell for TSV-based 2.5D and 3D products. It’s … Continue reading
Invensas to detail POP interconnect to rival Wide I/O with as many as 1200 interconnections between IC packages
Later this week, Invensas will detail its new BVA (bond via array) package-on-package (POP) interconnect that can achieve 1200 electrical connections between chip packages without the use of 3D die assembly. Information on the technology will be contained in a … Continue reading
Note: I just published this blog entry on my EDA360 Insider blog for 3D Thursday but the topic is so relevant to the conversation in the Denali Memory Report that I am republishing it here as well. A recent email … Continue reading
Quickly Noted: EETimes on the challenges of testing semiconductor memory for mobile applications. Is testing really a 3D IC “stopper”?
Janine Love at EETimes interviewed Cecil Ho, President of CST (Simmtester.com)—a memory tester vendor, about issues surrounding the testing of semiconductor memory that’s optimized for and aimed at mobile applications. In these applications board real estate and physical volume are … Continue reading