Tom’s Hardware is reporting that IBM recently obtained a patent on specially formulated phase-change memory (PCM) that will operate above 150°C. This is a significant achievement because PCM has a problem with ambient thermal annealing. If the chip temperature goes too high, then the phase-change memory cells will start to self erase as they change from their amorphous state to a crystalline state. This was not a problem for the recently announced LPDDR2 PCM/SDRAM combo device from Micron. (See “3D Thursday: Micron stacks Phase-Change Memory and SDRAM”) I know it’s not a problem for the device’s 0-85°C temperature range because I asked about that problem. Operating at more than 150°C is yet another story entirely.
Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
What's hot on the Denali Memory Report?
- Compact Flash
- Hybrid Memory Cube
- NVM Express
- Wide I/O