3D can’t move forward until the testability issues are solved. Hear that one? Well, Advantest has just advanced another click in that ratchet with this week’s introduction of a concept model test cell for TSV-based 2.5D and 3D products. It’s called DIMENSION and it’s designed for:
- Delicate and thin die handling
- Active thermal management
- Overall yield management
The DIMENSION tester employs a Smart Die Carrier so that the tester can pick and place thin die with fine-pitch contacts. Soft-touch handling is built in to prevent cracking of thinned semiconductor die. Built-in Active Thermal Control permits testing to spec and yield parameters. Together, these innovations permit the tester to produce tested KGD (known good die) and KGS (known good stacks).