3D can’t move forward until the testability issues are solved. Hear that one? Well, Advantest has just advanced another click in that ratchet with this week’s introduction of a concept model test cell for TSV-based 2.5D and 3D products. It’s called DIMENSION and it’s designed for:
- Delicate and thin die handling
- Active thermal management
- Overall yield management
The DIMENSION tester employs a Smart Die Carrier so that the tester can pick and place thin die with fine-pitch contacts. Soft-touch handling is built in to prevent cracking of thinned semiconductor die. Built-in Active Thermal Control permits testing to spec and yield parameters. Together, these innovations permit the tester to produce tested KGD (known good die) and KGS (known good stacks).
Next problem?
Denali Memory Report 