3D Thursday: Advantest 3D tester produces known good die and known good stacks

3D can’t move forward until the testability issues are solved. Hear that one? Well, Advantest has just advanced another click in that ratchet with this week’s introduction of a concept model test cell for TSV-based 2.5D and 3D products. It’s called DIMENSION and it’s designed for:

  • Delicate and thin die handling
  • Active thermal management
  • Overall yield management

The DIMENSION tester employs a Smart Die Carrier so that the tester can pick and place thin die with fine-pitch contacts. Soft-touch handling is built in to prevent cracking of thinned semiconductor die. Built-in Active Thermal Control permits testing to spec and yield parameters. Together, these innovations permit the tester to produce tested KGD (known good die) and KGS (known good stacks).

Next problem?

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About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at http://eda360insider.wordpress.com/)
This entry was posted in 3D, Wide I/O and tagged , , , . Bookmark the permalink.

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