Invensas to detail POP interconnect to rival Wide I/O with as many as 1200 interconnections between IC packages

Later this week, Invensas will detail its new BVA (bond via array) package-on-package (POP) interconnect that can achieve 1200 electrical connections between chip packages without the use of 3D die assembly. Information on the technology will be contained in a paper titled “Fine Pitch Copper PoP for Mobile Applications” to be given during the 3D Technology session (June 1) at the Electronic Components and Technology Conference (ECTC) at the Sheraton San Diego Hotel and Marina in San Diego.

The Invensas press release claims that the company’s BVA technology permits as many as 1200 interconnections between packages using conventional POP assembly techniques using an interconnect pitch as small as 0.2mm. Because it is a POP technology, Invensas also claims that its BVA technology extends the life of the existing package assembly and SMT infrastructure.

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About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at http://eda360insider.wordpress.com/)
This entry was posted in 3D, Wide I/O and tagged , , , . Bookmark the permalink.

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