Last week, the Hybrid Memory Cube Consortium announced that Microsoft had joined Micron, Samsung, Altera, IBM, Open-Silicon, and Xilinx in the development of high-performance 3D SDRAM subsystems based on the Hybrid Memory Cube.
For more information on the Hybrid Memory Cube, see:
- 3D Thursday: Hybrid Memory Cube—wide I/O only more so—gets an industry consortium
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- 3D Thursday: Micron’s 3D Hybrid Memory Cube delivers more DRAM bandwidth at lower power and in a smaller form factor using TSVs
- Is 2012 going to be another breakout year for NAND Flash and Low-Power Design?
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
Denali Memory Report 