The January IEEE Spectrum contained an article titled “3-D Chips Grow Up.” The article reproduced a simple Samsung bar graph about the very real advantages of 3D memory interconnect. That graph tells you all you need to know about why there’s a push to get 3D IC assembly off the ground, at least for memory. Bandwidth up 800%. Power consumption down 50%. Real estate on the pcb reduced by 65%. (Thanks to David Thon for the tip.)
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And latency? Increased 100x for writes and 1000x for reads. Flash is dead.
Sorry, I can’t agree about Flash being dead, Erica. There are a lot of technologies that aspire to killing NAND Flash. STT-MRAM, Memristor, and ReRAM just to name three. But none of them are in volume production yet. Flash ain’t dead. Flash lives.