Samsung has announced that it has started volume production of a combined NAND Flash/DRAM “embedded multichip module” (eMCP). The module combines 30nm-class LPDDR2 DRAM chips (packaged capacities of 256, 512, or 768 Mbytes) with 4Gbytes of 20nm-class NAND Flash in one surface-mount package. The target market for this device is the smartphone market but many other embedded applications can also make use of a device like this. Samsung has been offering such modules for a while. For example, the Denali Memory Report covered the introduction of a similar device that combined DRAM and phase-change memory (PCM) back in May, 2010.
Denali Memory Report:
The Denali Memory Report is produced by Cadence Design Systems, Inc. It delivers memory market news, discussions of market trends, products and product strategies of the memory vendors, plus information about alliances and industry consortia.
Subscribe to Denali Memory Report!
- Some great analysis on SSD wear leveling and power consumption
- The Economist covers PCM – must be something real
- Add OCZ to the growing list of SSD vendors differentiating their drives with a proprietary controller
- IDT announces DDR4 register chip for DDR4 registered DIMMs and 3D die stacks
- Western Digital sampling 5mm, 2.5-inch, 500Gbyte hybrid HDD with NAND Flash
What's hot on the Denali Memory Report?
- Compact Flash
- Hybrid Memory Cube
- NVM Express
- Wide I/O