Tag Archives: Micron

How ya gonna’ control that DDR4 SDRAM next year? The 28nm answer.

Cadence has just completed testing of its DDR4 SDRAM controller and PHY in two of the TSMC 28nm process technologies: 28HPM and 28HP. The DDR4 PHY exceeds the data rates needed to operate DDR-2400 SDRAMs and it is interoperable with … Continue reading

Posted in DDR, DDR3, DDR4, DRAM, LPDDR2, SDRAM | Tagged , , , , , , , | Leave a comment

Initial Hybrid Memory Cube short-reach interconnect specification issued to Consortium adopters

The Hybrid Memory Cube Consortium (HMCC), now supported by the three top DRAM vendors (Samsung, SK hynix, and Micron), has just issued an initial draft specification for the Hybrid Memory Cube’s “short-reach interconnection across physical layers”—in other words, the short-reach … Continue reading

Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix, Micron, Samsung | Tagged , , , , , , | Leave a comment

Unigen (and others) continue to roll out new mSATA SSDs

The Mini-SATA or mSATA form factor and interface standard for SSDs has been around since September, 2009 and it now seems to be gaining substantial traction in the form of several new product introductions over the last couple of months. … Continue reading

Posted in mSATA, SSD, Storage | Tagged , , , , , , | Leave a comment

Want more details about the new Micron 1Gbit Phase-Change Memory / 512Mbit SDRAM device? Here are several

Yesterday, Micron announced volume production of a new memory device containing one 1Gbit PCM (phase-change memory) die and one 512Mbit LPDDR2 SDRAM die. This morning, I had a conversation about this new device with Philippe Berge—Senior Director of the NOR, … Continue reading

Posted in DDR, Flash, LPDDR2, Micron, NOR, PCM, Storage | Tagged , , , , , , , | Leave a comment

Want another opinion about the Hybrid Memory Cube? Michael Feldman of HPCwire.com weighs in

Michael Feldman over at HPCwire.com has just published his own analysis of the Hybrid Memory Cube (HMC), which I’ve covered extensively in the EDA360 Insider and the Denali Memory Report (see below). Feldman reiterates many of the same points I’ve … Continue reading

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Applied Materials develops Centura Avatar etcher for enabling 3D NAND Flash manufacture

About a year ago, I wrote an EDA360 Insider blog entry about 3D NAND Flash semiconductor memory. (See “3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron”) In this post, I discussed a talk by Glen … Continue reading

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ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC). First spec due by end of year

Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading

Posted in 3D, DRAM, HMC, Hybrid Memory Cube, Hynix | Tagged , , , , , , | 1 Comment